agilent aba-32563 2.5 ghz broadband silicon rfic amplifier data sheet description agilents aba-32563 is an economical, easy-to-use, inter- nally 50 ? matched, silicon monolithic broadband amplifier that offers excellent gain and broadband response from dc to 2.5 ghz. packaged in an ultra- miniature sot-363 package, it requires half the board space of a sot-143 package. at 2 ghz, the aba-32563 offers a small-signal gain of 19 db, output p1db of 8.4 dbm and 19.5 dbm output third order intercept point. it is suitable for use as wideband applications. they are designed for low cost gain blocks in cellular applica- tions, dbs tuners, lnb and other wireless communication systems. aba-32563 is fabricated using agilents hp25 silicon bipolar process, which employs a double- diffused single polysilicon process with self-aligned submi- cron emitter geometry. the process is capable of simulta- neous high f t and high npn breakdown (25 ghz f t at 6v bvceo). the process utilizes industry standard device oxide isolation technologies and submicron aluminum multilayer interconnect to achieve superior performance, high uniformity, and proven reliability. features operating frequency dc ~ 2.5 ghz 19 db gain vswr < 2.0 throughout operating frequency 8.4 dbm output p1db 19.5 dbm output ip3 3.5 db noise figure unconditionally stable single 3v supply (id = 37 ma) applications amplifier for cellular, cordless, special mobile radio, pcs, ism, wireless lan, dbs, tvro, and tv tuner applications surface mount package sot-363/sc70 pin connections and package marking simplified schematic note: top view. package marking provides orientation and identification. x is the date code. vcc gnd 3 2kx input gnd 2 gnd 1 outpu t & vcc vcc ground 2 ground 1 ground 3 rf input rf output & vcc
2 aba-32563 absolute maximum ratings [1] symbol parameter units absolute max. v cc device voltage, rf output to ground (t = 25 c) v 6 p in cw rf input power (vcc = 3v) dbm 15 p diss total power dissipation [3] w 0.6 t j junction temperature c 150 t stg storage temperature c -65 to 150 notes: 1. operation of this device in excess of any of these limits may cause permanent damage. 2. thermal resistance measured using 150 c liquid crystal measurement technique. 3. board (package belly) temperature, tc, is 25 c. derate 8.1 mw/ c for tc > 120.8 c. electrical specifications t c = +25 c, z o = 50 ? , p in = -30 dbm, v cc = 3v, freq = 2 ghz, unless stated otherwise. symbol parameter and test condition units min. typ. max. std dev. gp [1] power gain (|s 21 | 2 ) db 17.5 19.0 ? gp power gain flatness, f = 0.1 ~ 1.5 ghz db 1.0 f = 0.1 ~ 2.5 ghz 3.0 nf [1] noise figure db 3.5 4.4 p1db [1] output power at 1db gain compression dbm 8.4 oip3 [1] output third order intercept point dbm 19.5 vswr in [1] input vswr <1.5 vswr out [1] output vswr <1.5 icc [1] device current ma 37 42.5 td [1] group delay ps 140 notes: 1. measurements taken on 50 ? test board shown on figure 1. excess circuit losses had been de-embedded from actual measurements. standard deviation and typical data based on at least 500 parts sample size from 2 wafer lots. future wafers allocated to this product may have nominal values anywhere within the upper and lower spec limits. figure 1. aba-32563 production test circuit. thermal resistance [2] (vcc = 3v) j-c = 124.3 c/w rf outp f input vcc 2kx c bypass 100 pf c bypass 1000 pf rfc 3 3 nh c block 1 nf c block 1 nf
3 aba-32563 typical performance t c = +25 c, z o = 50 ? , v cc = 3v unless stated otherwise. frequency (ghz) figure 2. gain vs. frequency and voltage. gain (db) 0 22 20 18 16 14 12 4 1 0.5 2 2.5 3 1.5 3.5 3.5v 3v 2.7v frequency (ghz) figure 3. gain vs. frequency and temperature. gain (db) 0 22 20 18 16 14 12 4 1 0.5 2 2.5 3 1.5 3.5 +85 c +25 c -40 c frequency (ghz) figure 4. noise figure vs. frequency and voltage. nf (db) 0 5 4.5 4 3.5 3 2.5 2 4 1 0.5 2 2.5 3 1.5 3.5 3.5v 3v 2.7v frequency (ghz) figure 5. noise figure vs. frequency and temperature. nf (db) 0 5 4.5 4 3.5 3 2.5 2 4 1 0.5 2 2.5 3 1.5 3.5 +85 c +25 c -40 c frequency (ghz) figure 6. output power for 1 db gain compression vs. frequency and voltage. p1db (dbm) 0 13 11 9 7 5 3 4 1 0.5 2 2.5 3 1.5 3.5 3.5v 3v 2.7v frequency (ghz) figure 7. output power for 1 db gain compression vs. frequency and temperature. p1db (dbm) 0 13 11 9 7 5 3 4 1 0.5 2 2.5 3 1.5 3.5 +85 c +25 c -40 c
4 aba-32563 typical performance, continued t c = +25 c, z o = 50 ? , v cc = 3v unless stated otherwise. frequency (ghz) figure 8. output ip3 vs. frequency and voltage. oip3 (dbm) 0 32 28 24 20 16 12 4 1 0.5 2 2.5 3 1.5 3.5 3.5v 3v 2.7v frequency (ghz) figure 9. output ip3 vs. frequency and temperature. oip3 (dbm) 0 32 28 24 20 16 12 4 1 0.5 2 2.5 3 1.5 3.5 +85 c +25 c -40 c frequency (ghz) figure 10. input and output vswr vs. frequency. vswr 1.8 1.6 1.4 1.2 1.0 vswr in vwsr out 04 1 0.5 2 2.5 3 1.5 3.5 voltage (v) figure 11. supply current vs. voltage and temperature. icc (ma) 0 120 100 80 60 40 20 0 2 1 456 3 7 +85 c +25 c -40 c
5 aba-32563 typical scattering parameters t c = +25 c, z o = 50 ? , v cc = 3v, unless stated otherwise freq s 11 s 11 s 21 s 21 s 21 s 12 s 12 s 22 s 22 k (ghz) mag. ang. db mag. ang. mag. ang. mag. ang. factor 0.10 0.12 171.5 20.0 10.00 -5.6 0.02 2.6 0.28 -6.5 2.70 0.20 0.11 167.2 20.0 10.04 -11.0 0.02 6.0 0.27 -12.9 2.70 0.30 0.11 162.7 20.1 10.07 -16.7 0.02 9.5 0.27 -18.8 2.70 0.40 0.10 158.0 20.1 10.09 -22.5 0.02 12.8 0.27 -24.8 2.70 0.50 0.10 139.9 20.0 10.02 -28.8 0.02 15.7 0.26 -27.6 2.60 0.60 0.10 129.4 20.0 9.95 -34.7 0.02 18.6 0.26 -31.7 2.60 0.70 0.10 121.2 19.9 9.88 -40.6 0.02 21.2 0.25 -35.9 2.50 0.80 0.09 111.6 19.8 9.79 -46.4 0.02 23.5 0.25 -40.4 2.40 0.90 0.09 102.0 19.7 9.69 -52.2 0.02 25.5 0.25 -45.0 2.40 1.00 0.09 93.3 19.6 9.58 -58.1 0.02 26.9 0.24 -49.8 2.30 1.10 0.08 84.1 19.5 9.48 -63.7 0.02 28.6 0.24 -54.5 2.30 1.20 0.08 75.4 19.4 9.35 -69.5 0.02 29.6 0.23 -59.4 2.20 1.30 0.08 66.5 19.3 9.24 -75.2 0.03 30.2 0.22 -64.5 2.10 1.40 0.08 55.2 19.2 9.12 -80.8 0.03 30.9 0.22 -69.8 2.10 1.50 0.08 45.2 19.1 8.99 -86.5 0.03 31.4 0.21 -75.2 2.10 1.60 0.07 34.1 19.0 8.86 -92.3 0.03 31.8 0.20 -80.7 2.00 1.70 0.08 24.4 18.8 8.71 -98.1 0.03 31.9 0.18 -86.4 2.00 1.80 0.08 10.6 18.6 8.54 -103.6 0.03 31.7 0.17 -92.0 2.00 1.90 0.08 -2.2 18.5 8.41 -109.3 0.03 31.9 0.16 -98.5 2.00 2.00 0.08 -12.5 18.4 8.27 -115.0 0.03 31.9 0.15 -105.6 2.00 2.20 0.08 -34.6 17.9 7.87 -126.4 0.03 31.8 0.12 -120.6 2.00 2.40 0.09 -57.6 17.5 7.51 -137.5 0.04 31.9 0.10 -139.2 2.00 2.60 0.10 -77.3 17.0 7.08 -148.8 0.04 32.3 0.08 -163.9 2.00 2.80 0.12 -93.3 16.4 6.64 -159.3 0.04 32.4 0.07 167.4 2.10 3.00 0.13 -108.3 15.9 6.21 -169.6 0.04 32.4 0.07 137.7 2.10 3.20 0.15 -124.9 15.3 5.81 -179.7 0.04 32.1 0.08 115.7 2.10 3.40 0.16 -137.7 14.6 5.39 170.6 0.05 32.2 0.09 98.7 2.10 3.60 0.19 -150.1 14.0 5.04 161.4 0.05 31.5 0.10 86.3 2.10 3.80 0.20 -162.9 13.5 4.71 152.1 0.05 31.0 0.12 78.9 2.10 4.00 0.22 -175.0 12.8 4.38 142.9 0.05 30.5 0.13 71.9 2.10 4.20 0.23 175.0 12.1 4.04 134.4 0.06 30.0 0.14 65.2 2.10 4.40 0.26 166.1 11.6 3.79 126.2 0.06 28.2 0.15 59.1 2.10 4.60 0.27 155.3 11.0 3.54 117.3 0.06 26.7 0.15 55.0 2.10 4.80 0.28 145.8 10.2 3.25 108.7 0.07 25.2 0.16 50.2 2.10 5.00 0.29 138.3 9.5 2.99 101.3 0.07 23.2 0.16 45.0 2.20 5.20 0.30 131.7 8.8 2.77 94.2 0.08 20.8 0.16 40.1 2.20 5.40 0.31 126.2 8.2 2.57 87.6 0.08 18.4 0.16 35.1 2.20 5.60 0.32 120.9 7.7 2.42 81.0 0.09 15.6 0.16 30.3 2.20 5.80 0.34 115.6 7.2 2.28 74.3 0.09 12.7 0.16 25.3 2.20 6.00 0.35 110.4 6.6 2.14 67.7 0.09 9.6 0.15 23.8 2.20
6 ordering information part number devices per container container aba-32563-tr1 3000 7" reel ABA-32563-TR2 10000 13" reel aba-32563-blk 100 antistatic bag package dimensions outline 63 (sot-363/sc-70) device models refer to agilents web site www.agilent.com/view/rf 2.20 (0.087) 2.00 (0.079) 1.35 (0.053) 1.15 (0.045) 1.30 (0.051) ref. 0.650 bsc (0.025) 2.20 (0.087) 1.80 (0.071) 0.10 (0.004) 0.00 (0.00) 0.25 (0.010) 0.15 (0.006) 1.00 (0.039) 0.80 (0.031) 0.20 (0.008) 0.10 (0.004) 0.30 (0.012) 0.10 (0.004) 0.30 ref. 10 0.425 (0.017) typ. dimensions are in millimeters (inches)
7 device orientation tape dimensions and product orientation for outline 63 p p 0 p 2 f w c d 1 d e a 0 8 max. t 1 (carrier tape thickness) t t (cover tape thickness) 5 max. b 0 k 0 description symbol size (mm) size (inches) length width depth pitch bottom hole diameter a 0 b 0 k 0 p d 1 2.24 0.10 2.34 0.10 1.22 0.10 4.00 0.10 1.00 + 0.25 0.088 0.004 0.092 0.004 0.048 0.004 0.157 0.004 0.039 + 0.010 cavity diameter pitch position d p 0 e 1.55 0.05 4.00 0.10 1.75 0.10 0.061 0.002 0.157 0.004 0.069 0.004 perforation width thickness w t 1 8.00 0.30 0.255 0.013 0.315 0.012 0.010 0.0005 carrier tape cavity to perforation (width direction) cavity to perforation (length direction) f p 2 3.50 0.05 2.00 0.05 0.138 0.002 0.079 0.002 distance width tape thickness c t t 5.4 0.10 0.062 0.001 0.205 0.004 0.0025 0.00004 cover tape user feed direction cover tape carrier tape reel end vie w 8 mm 4 mm top view (package marking example orientation shown.) 2kx 2kx 2kx 2kx
www.agilent.com/semiconductors for product information and a complete list of distributors, please go to our web site. for technical assistance call: americas/canada: +1 (800) 235-0312 or (916) 788-6763 europe: +49 (0) 6441 92460 china: 10800 650 0017 hong kong: (65) 6756 2394 india, australia, new zealand: (65) 6755 1939 japan: (+81 3) 3335-8152(domestic/international), or 0120-61-1280(domestic only) korea: (65) 6755 1989 singapore, malaysia, vietnam, thailand, philippines, indonesia: (65) 6755 2044 taiwan: (65) 6755 1843 data subject to change. copyright ? 2004 agilent technologies, inc. april 7 , 2004 5989-0756en
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